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WMT, WLT

Fast non-contact thickness, TTV and resistivity characterization.
Thickness and resistivity are primary quality control parameters for silicon wafers in PV applications.
The WLT models, WLT-1, -3 & -5 In-Line Thickness and Resistivity Testers allow measurement of thickness at 1 to 5 points and resistivity at 1 point with the high throughput that meets the requirements of in-line quality control in fully automated wafer production lines.
The WMT models, WMT-1 & -3, Thickness and Resistivity Testers allow measurement of wafers "on the fly", i.e., conveyor belt does not stop during measurement. Therefore, they have the high throughput that meets the requirements of in-line quality control in fully automated wafer production lines.

Features and System specifications:

-A versatile electrical technique for characterizing depth profiles from surface through any multilayer structures of arbitrary depth

-Offers high spatial and depth resolution

-The technology can be used on wide range of resistivities & dopant densities


The SRP product line can be used in the following applications:

  •Resistivity and doping depth profile determination in silicon semiconductor epitaxial layers

  •Process monitoring of ion implantation

  •Real structure determination of final devices

  •Measurement on patterned samples