The Semilab LEI family allows for non-destructive measurement of sheet resistance. These instruments are optimized for compound semiconductor applications with ranges of operation that dovetail nicely with customer applications. The LEI technology became the process of record in the RF device area with many people asking to see the “LEI” map.
4 Point Probe (multiple heads) & Non-contact probes (JPV & EDDY) combined in one platform for better operability and long-term stability for wafer makers, device manufacturers and implanter suppliers.
The Solar Cell Wafer Topology Measurement system is a complete system for thickness, resistivity and two-sided saw mark measurements.
Fast non-contact thickness, TTV and resistivity characterization.
Thickness and resistivity are primary quality control parameters for silicon wafers in PV applications.
The WLT models, WLT-1, -3 & -5 In-Line Thickness and Resistivity Testers allow measurement of thickness at 1 to 5 points and resistivity at 1 point with the high throughput that meets the requirements of in-line quality control in fully automated wafer production lines.
The WMT models, WMT-1 & -3, Thickness and Resistivity Testers allow measurement of wafers "on the fly", i.e., conveyor belt does not stop during measurement. Therefore, they have the high throughput that meets the requirements of in-line quality control in fully automated wafer production lines.
The WT product line is a powerful measurement platform for performing many different semiconductor material characterization measurements. The base system includes all the overhead functions necessary to perform characterization measurements, including power supplies, computer and operating software, X-Y measurement stage and so on. The WT is typically used to make maps, where the wafer is scanned at a programmable raster. Each system is configured to the user’s requirements by adding treatment and measurement capabilities.
