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Semiconductor inspection

  • Optical Measurement
    Rapid non-contact and non-destructive FTIR inspection system (configured with reflection and transmission measurement option) for epitaxial thickness, dielectric composition and high dopant concentration measurement for wafer maker and IC manufacturer industry.
    PRODUCT
    EIR
    EIR
    SEMILAB SE Series are state of the art, cost effective ellipsometers addressing semiconductor More-than-Moore, III-V (GaN, InGaAs), Micro (O)LED industry. With more than 30 years of experience in ellipsometry, SEMILAB offers an extensive application knowledge and library to support start production and long-term development.
    PRODUCT
    SE
    SE
    En-Vision is a new generation inspection system specifically targeting quick and non-destructive detection of nm scale buried defects. Buried defects are located under the silicon surface, invisible to conventional inspection tools (Optical / SEM), and when occurring in the active areas impact device performance and yield.
    PRODUCT
    En-Vision
    En-Vision
    The PMR system provides a non-contact optical method for in-line monitoring of ion implantation processes of silicon product wafers for various device process flow types in the memory, automotive or power device industries.
    PRODUCT
    PMR
    PMR
  • Electrical Measurements
    All Semilab's MCV systems are equipped with automated, full hand-off, mercury handling system to increase safety and reliability. The user friendly software environment controls the measurements and also offers a great flexibility for detailed analysis of the measured structures. Full map capability up to 12"/300 mm. All features listed, including optional ones, are compatible with both the manual MCV-530(L) and the automatic
    MCV-2200/2500/3000/3000P systems.
    PRODUCT
    MCV
    MCV
    Explore the entire carrier density and resistivity profile in all silicon semiconductor structures of device processing with this automated system. Measurement range covers state-of-the art application needs.
    PRODUCT
    SRP
    SRP
    Gate dielectrics characterization and resistivity monitoring with site-based measurements
    (typically 5 or 9 points per wafer according to SEMI standard testing patterns).
    Specially designed probe ensures that no damage is done to the wafer, because the probe is not contaminating the wafer surfaces.
    PRODUCT
    FCV
    FCV
    4 Point Probe (multiple heads) & Non-contact probes (JPV & EDDY) combined in one platform for better operability and long-term stability for wafer makers, device manufacturers and implanter suppliers.
    PRODUCT
    RT
    RT
    Semilab’s QC platforms (Near Surface Doping Mappers) for epitaxial monitoring are the only non-contact, non-destructive, high throughput systems that can reliably map near surface doping on process wafers.
    PRODUCT
    QC
    QC
  • Nano Surface Measurement
    Use the zoom capabilities of the SEM to navigate your AFM tip directly to the region of interest. Access information about topography, mechanical, electrical and magnetic properties of the surface with nanometer resolution. Use the AFM tip as a nanomanipulator with force feedback. The AFM is available for Merlin and Crossbeam series (other Zeiss SEM series on inquiry). Already existing systems can be updated by simply exchanging the door.
    PRODUCT
    AFM
    AFM