Semilab's COREMA system is based on a contactless capacitance technique used for precise resistivity characterization of semi-insulating compound semiconductors over a wide resistivity range, useful for the device manufacturing industry.
Knowing the uniformity of resistivity and mobility values is critical to achieve process optimization.
Mapping is critical for semi-insulating semiconductor QA processes as they show inhomogeneities that occur during manufacturing
All Semilab's MCV systems are equipped with automated, full hand-off, mercury handling system to increase safety and reliability. The user friendly software environment controls the measurements and also offers a great flexibility for detailed analysis of the measured structures. Full map capability up to 12"/300 mm. All features listed, including optional ones, are compatible with both the manual MCV-530(L) and the automatic
MCV-2200/2500/3000/3000P systems.
The Semilab LEI family allows for non-destructive measurement of sheet resistance. These instruments are optimized for compound semiconductor applications with ranges of operation that dovetail nicely with customer applications. The LEI technology became the process of record in the RF device area with many people asking to see the “LEI” map.
SPL is a non-contact, non-destructive, spectroscopy-based measurement system to probe the electronic structure of different materials.
4 Point Probe (multiple heads) & Non-contact probes (JPV & EDDY) combined in one platform for better operability and long-term stability for wafer makers, device manufacturers and implanter suppliers.
Explore the entire carrier density and resistivity profile in all silicon semiconductor structures of device processing with this automated system. Measurement range covers state-of-the art application needs.
