Features and System specifications:

•Integrated universal (for both p- and n-type) UV/Corona pre-treatment with improved and optimized UV oxidation for up-to 300 mm wafers and accurate feedback loop controlled corona charging technique with new mechanical and electronics design and new corona system.

•New sensor design insensitive to wafer/chuck flatness.

•Rapidity of even full wafer mapping measurements ensures an impressive throughput and the ability to monitor and control the epitaxial process

•Improved new software has multiple benefits, such as: highly configurable, multitasking, real-time data monitoring, simplified recipe generation, job queuing and fully 300mm SECS/GEM complaint.

•Wafer motion stage with precise positioning

•Detects problems that may escape other metrology techniques, because of the strong surface sensitivity

•Qualifies Epi layer within the critical device region of IC

•Provides near-surface carrier lifetime as an indicator of wafer contamination

•Fast full wafer mapping capability

•Measures all doping combinations: n/p, n/n, p/n, p/p