Features and System specifications:

  •Thickness measurement - 6 lines of thickness detection

  •Resistivity measurement - 1 line of resistivity measurement along the center line of the wafer with a non-contact Eddy current type sensor.

  •P/N determination - conductivity type (P or N) is measured in one point in the middle of the wafer with a non-contact SPV sensor.

  •Saw mark - 6 lines of saw mark detection

  •The data are transferred to the Data Collector PC