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PMR

The PMR system provides a non-contact optical method for in-line monitoring of ion implantation processes of silicon product wafers for various device process flow types in the memory, automotive or power device industries.

Features and System specifications:

Implant dose:

  •Species As, B, P, BF2, In, Sb, C (application for other species under development)


Process requirements - Unannealed implanted layers, Surface oxide

Fully SEMI-compliant (300 mm) automation

Overhead transport (OHT) available

Fully compliant to Tier 1 contamination specs, including Class 1 mini-environment

Two FOUPs capable of handling wafers up to 300 mm size


State of the art software:

  •Recipe-based operation

  •Host communication

  •Different access levels


Pattern recognition option