Features and System specifications:

•Implant dose

•Species As, B, P, BF2, In, Sb, C (application for other species under development)

•Process requirements - Unannealed implanted layers, Surface oxide

•Fully SEMI-compliant (300 mm) automation

•Overhead transport (OHT) available

•Fully compliant to Tier 1 contamination specs, including Class 1 mini-environment

•Two FOUPs capable of handling wafers up to 300 mm size

•State of the art software:

•Recipe-based operation

•Host communication

•Different access levels

•Pattern recognition option