Features and System specifications:

•Thickness measurement - 6 lines of thickness detection

•Resistivity measurement - 1 line of resistivity measurement along the center line of the wafer with a non-contact Eddy current type sensor.

•P/N determination - conductivity type (P or N) is measured in one point in the middle of the wafer with a non-contact SPV sensor.

•Saw mark - 6 lines of saw mark detection

•The data are transferred to the Data Collector PC