Features and System specifications:

Inspected area:

  •Product wafers

    -Measurement boxes

    -In device

  •Blanket and monitoring wafers

Defects being detected: Buried extended defects (Dislocations, Oi precipitates, COP, Stacking faults and so on)

Detection limit based on BMD detection of Oi precipitate defects

Data Acquisition:  

  •Image segmentation (measurement box and device area)

  •Die to die inspection

  •Image stitching (larger FOV)

Data Analysis: 

  •Statistical tools

  •Defect classification

  •Batch / Lot Reprocessing

Data Output: SECS GEM, KLARF, Export