Features and System specifications:

Automatic robotic wafer handling

Dual FOUP Loadport; optional configuration with single Loadport or including Versaport

Suitable for patterned wafer (Micro) and monitor wafer (Macro) measurements

Semilab SDI patented high resolution (10µm) Micro corona-Kelvin based on Kelvin Probe Force Microscopy (KPFM) for measurement of dielectric and interface properties in Scribe Line test sites (down to 40µm x 40µm) and active device regions

Advanced 2 step Non-Visual Defect (NVD) Inspection that combines full wafer Macro surface voltage imaging and focused high resolution intra-die surface voltage imaging using KPFM

Automatic programmable sites or contour mapping of dielectric properties including

•Dielectric Capacitance (CD) and Thickness (EOT),

•Dielectric Leakage Current (I-V)

•Flatband Voltage (Vfb),

•Interface Trap Density (Dit),

•Interface Trapped Charge (Qit),

•Semiconductor Surface Barrier (Vsb),

•Oxide Total Charge (Qtot),

•Mobile Ionic Charge (Qm), among others

FAaST software package; including Measurement, Recipe Writing and Data Viewing applications

Suitable for measurement on: semiconductors (e.g. Si, SiGe, InGaAs, SiC, GaN) with high-k and low-k dielectric films (e.g. SiO2, SiNx, Al2O3, HfO2 ; mixed dielectrics and dielectric film stacks)

Default configuration for 300mm wafers; with option for 200mm/300mm bridge configuration

Line Conditioner with flexible compatibility

Compatible for configuration with other Semilab SDI FAaST tool measurement technologies

Additional available options include: Mini-environment, 300mm Semi compliant Automation, Seismic brackets, wafer OCR, RFID, cassette barcode reader, 1000V Vcpd measurement range