Features and System specifications

Inspected area:

•Product wafers

   -Measurement boxes

   -In device

•Blanket and monitoring wafers

•Defects being detected: Buried extended defects (Dislocations, Oi precipitates, COP, Stacking faults and so on)

•Detection limit based on BMD detection of Oi precipitate defects

Data Acquisition:  

•Image segmentation (measurement box and device area)

•Die to die inspection

•Image stitching (larger FOV)

Data Analysis: 

•Statistical tools

•Defect classification

•Batch / Lot Reprocessing

Data Output: SECS GEM, KLARF, Export